To provide a putty surfacing tool for shortening a polishing work time, facilitating polishing work, and improving the finish of a repairing place surface, by minimizing puttying to a repairing place.

This putty surfacing tool is manufactured from a plate-like metallic raw material having proper rigidity, a plastic plate such as vinyl chloride or an aluminum plate, and is constituted by press-fitting by respectively attaching a sealant of silicon to the plate-like metallic raw material and the plastic plate or the aluminum plate.