Title:
QUARTZ MODULE BOARD, MANUFACTURING METHOD OF THE QUARTZ MODULE BOARD, AND QUARTZ MODULE
Document Type and Number:
Japanese Patent JP2003218637
Kind Code:
A
Abstract:
To downsize various electronic device each configured with a quartz module.
A container part 5 for containing a quartz chip 50 is formed to a ceramic multilayer board 2. The quartz chip 50 is connected to lead electrodes 16, 16 formed on an insulation layer 12 in the container part 5 and a cover 6 is joined with a joining face 18 formed to an upper edge of the container part 5 to air-tightly sealing inside of the container part 5 thereby forming a quartz vibrator in a quartz module board 2. Thus, it is not required to mount the quartz vibrator on the front side of the quartz module board 2 to downsize the quartz module board 2.
Inventors:
MIMURA KAZUHIRO
Application Number:
JP2002010123A
Publication Date:
July 31, 2003
Filing Date:
January 18, 2002
Export Citation:
Assignee:
TOKYO DENPA KK
International Classes:
H03B5/32; H03H3/02; (IPC1-7): H03B5/32; H03H3/02
Attorney, Agent or Firm:
Atsuo Waki (1 person outside)
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