QUARTZ OSCILLATOR AND ITS PRODUCTION

Japanese Patent JP3390348

B2

PROBLEM TO BE SOLVED: To prevent adhering of a metal of a low melting point to quartz oscillator pieces due to outgasing, to prevent the increase of a quartz impedance and also to improve the frequency characteristics of a quartz oscillator by anode-bonding the metallic layers formed on the upper and lower faces of an outer frame which is integrated with the quartz oscillator and a cover and a case.
SOLUTION: A tuning fork-type quartz oscillator 60 and an outer frame 50 connected to one of both ends of the oscillator 60 are formed by etching on a quartz substrate. Then the attached electrodes 90 and metallic layers 30 and 40 are formed on the surfaces of the oscillator 60 and the frame 50. A glass cover 10 having an etched recess part 12 is bonded via an anode to a face opposite to the top face of the oscillator 60. Finally, a glass case 70 having an etched recess part 72 is bonded via an anode to a face opposite to the lower face of the oscillator 60. An exciting electrode is placed at every oscillating part and integrated with the frame 50. Thus, it's possible to collectively perform both mounting and sealing processes of the oscillator pieces and accordingly to shorten the manufacturing process of the oscillator 60.

Kiyoshi Aratake
Masayoshi Shiraishi

JP23610698A

March 24, 2003

August 21, 1998

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Seiko Instruments Inc.

H03H3/02; H03H3/04; H03H9/05; H03H9/10; H03H9/19; H03H9/215; (IPC1-7): H03H9/19; H03H3/02; H03H9/10

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Masaaki Sakaue

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