Title:
QUICK-DRYING ETCHING RESIST INK COMPOSITION FOR MANUFACTURING ELECTRONIC CIRCUIT BOARD, AND PRINTING METHOD
Document Type and Number:
Japanese Patent JP2005051056
Kind Code:
A
Abstract:
To provide an etching resist ink composition for manufacturing an electronic circuit board in which a film can be formed in a short time on a copper clad multilayer board or an electronic circuit board without using extra equipment or material.
Immediately after printing on an article (a copper clad multilayer board or an electronic circuit board) using a nonaqueous etching resist ink composition containing a water soluble solvent and a water insoluble solvent where a printed part dries up quickly through contact with water, the article is touched to water thus forming an etching resist film or a marking.
Inventors:
ARAI MASUMI
KAMIYA YASUHITO
OTSUBO YASUBUMI
EDAMURA KAZUYA
KAMIYA YASUHITO
OTSUBO YASUBUMI
EDAMURA KAZUYA
Application Number:
JP2003281722A
Publication Date:
February 24, 2005
Filing Date:
July 29, 2003
Export Citation:
Assignee:
FUJI PRINT KOGYO KK
MAKII ENGINEERING KK
NEW TECHNOLOGY MAN CO LTD
MAKII ENGINEERING KK
NEW TECHNOLOGY MAN CO LTD
International Classes:
C09D11/033; C09D11/10; C09D11/106; C09D11/107; C09D11/108; C09D11/30; H05K3/06; (IPC1-7): H05K3/06; C09D11/10
Attorney, Agent or Firm:
Satoshi Furuya
Takahiko Mizobe
Shinji Mochida
Yoshitsune Kazumasa
Takahiko Mizobe
Shinji Mochida
Yoshitsune Kazumasa
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