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Patent Searching and Data


Title:
QUINOLINE COMPOUND, ITS PRODUCTION AND HEAT-RESISTANT RESIN USING THE SAME
Document Type and Number:
Japanese Patent JPH1149754
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To obtain a quinoline compound for producing a heat-resistant resin capable of improving workability and solubility of a polyquinoline and lowering its hygroscopic property, by reacting a ketomethylene compound with a specific ether. SOLUTION: This compound is shown by formula I (R is H, a 1-8C alkyl, a 6-18C aryl, etc.; R' is H, a 1-8C alkyl, a 6-18C aryl, a 1-20C alkoxy, etc.); X is F, Cl, Br or I; (l) is 1-5; (m) is 0-4 and (l+m) is 5). The compound is preferably obtained by reacting a ketomethylene compound of formula II with 4,4'- diamino-3,3'-dibenzoyldiphenyl ether in a solvent such as benzene in the presence of an acid catalyst such as hydrochloric acid at -20 to 250 deg.C for about 30 minutes to 24 hours.

Inventors:
UEJIMA KOICHI
KAJI MAKOTO
WADA YUMIKO
KUWANA YASUHIRO
Application Number:
JP20875397A
Publication Date:
February 23, 1999
Filing Date:
August 04, 1997
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C07D215/20; C08G65/40; (IPC1-7): C07D215/20; C08G65/40
Attorney, Agent or Firm:
Hotaka Tetsuo