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Patent Searching and Data


Title:
バリカンにおけるRF電極組立品
Document Type and Number:
Japanese Patent JP2006521178
Kind Code:
A
Abstract:
An RF device has a support structure. An RF electrode, coupled to the support structure, includes conductive and dielectric portions. A cooling member, coupled to the support structure, is configured to cool a back surface of the RF electrode. The cooling member is distanced from the back surface of the RF electrode.

Inventors:
Levinson Mitch
Webber brian
Stern Roger A
Application Number:
JP2006509276A
Publication Date:
September 21, 2006
Filing Date:
March 25, 2004
Export Citation:
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Assignee:
THERMAGE INC.
International Classes:
A61F7/00; A41D13/005; A45D44/22; A61B18/12; A61B18/14; A61B18/18; A61B19/00; A61N1/04; A61N1/06; A61N1/28; A61N1/30; A61N1/32; A61N1/40; A61N5/04; A61N5/06; A61B18/00; A61F7/02; A61H7/00; A61H9/00; A61B; A61N
Attorney, Agent or Firm:
Sadao Kumakura
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda