Title:
RFIDタグアセンブリ
Document Type and Number:
Japanese Patent JP5124710
Kind Code:
B2
Abstract:
Components for use in a temperature controlled heatable object are provided in which a temperature sensor is connected to a transmitter such as a Radio Frequency Identification (RFID) tag. The RFID tag is encased in a protective overmolding and connected to the temperature sensor via a mineral insulated cable. An end cap containing a potting material (such as silicone or ceramic) is placed over the temperature sensor and laser welded to a sheathing of the mineral insulated cable. A potting material for use in a heatable object is also provided comprising a silicone-based material that is modified by adding bauxite to increase thermal conductivity.
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Inventors:
Imura Mamoru
Michael f johnson
Michael f johnson
Application Number:
JP2008515901A
Publication Date:
January 23, 2013
Filing Date:
June 07, 2006
Export Citation:
Assignee:
Vita Craft Japan Co., Ltd.
International Classes:
A47J27/00; H05B6/12; A47J27/62; A47J39/02; H04B1/59; H04B5/02; H05B1/02; A47J45/06; A47J45/07
Domestic Patent References:
| JP2006517334A | ||||
| JP2003017514A | ||||
| JP2003529184A |
Foreign References:
| WO2004071131A2 | ||||
| US6444961 |
Attorney, Agent or Firm:
Rikio Murota
Takuji Hashiba
Takuji Hashiba
Previous Patent: JPS5124709
Next Patent: SORTING METHOD FOR COLD INSULATION/HEAT INSULATION MERCHANDISE
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