Title:
R-T-B BASED SINTERED MAGNET AND PREPARATION METHOD THEREOF
Document Type and Number:
Japanese Patent JP2021174996
Kind Code:
A
Abstract:
To provide an R-T-B based sintered magnet and a preparation method thereof.SOLUTION: The sintered magnet hereof includes: a grain boundary region T1; a shell layer region T2; and an R2Fe14B particle region T3. In the sintered magnet, in a location of 10-60 μm from a surface of the sintered magnet toward a center, the areal ratio of the shell layer region T2 and the R2Fe14B particle region T3 is 0.1-0.3, the shell layer region T2 has a thickness of 0.5-1.2 μm, and the average coverage of the shell layer region T2 to the R2Fe14B particle region T3 is 80% or larger.EFFECT: By optimizing a manufacturing process and a fine structure of a rare earth permanent magnet, the diffusion efficiency of a heavy rare earth in the magnet is improved, the magnet coercive force is largely raised, the manufacturing cost is reduced. The sintered magnet can reduce a quantity of heavy rare earth under such a condition that a common coercive force is achieved, so it is suitable for industrial production.SELECTED DRAWING: Figure 2
Inventors:
LUO YANG
YU DUNBO
ZHU WEI
BAI XINYUAN
LIN XIAO
ZHU SHENGJIE
WANG ZILONG
PENG HAIJUN
YU DUNBO
ZHU WEI
BAI XINYUAN
LIN XIAO
ZHU SHENGJIE
WANG ZILONG
PENG HAIJUN
Application Number:
JP2021073953A
Publication Date:
November 01, 2021
Filing Date:
April 26, 2021
Export Citation:
Assignee:
GRIREM ADVANCED MAT CO LTD
RARE EARTH FUNCTIONAL MAT XIONG AN INNOVATION CENTER CO LTD
GRIREM RONGCHENG CO LTD
RARE EARTH FUNCTIONAL MAT XIONG AN INNOVATION CENTER CO LTD
GRIREM RONGCHENG CO LTD
International Classes:
H01F1/057; H01F41/02
Domestic Patent References:
| JP2010114200A | 2010-05-20 | |||
| JP2020013975A | 2020-01-23 | |||
| JP2018093202A | 2018-06-14 |
Foreign References:
| WO2013191276A1 | 2013-12-27 | |||
| WO2007088718A1 | 2007-08-09 | |||
| WO2006112403A1 | 2006-10-26 | |||
| WO2009004794A1 | 2009-01-08 |
Attorney, Agent or Firm:
try international patent corporation
Previous Patent: Flip chip bonding equipment using VCSEL elements
Next Patent: Sensors and electronic devices
Next Patent: Sensors and electronic devices