Title:
RADIATION CURABLE COMPOSITION
Document Type and Number:
Japanese Patent JP2006036947
Kind Code:
A
Abstract:
To prepare a sealing material layer by using a photosetting composition, which is usable under a high-temperature condition in a cured state without losing the function as an elastic sealing material.
The subject radiation curable composition is composed mainly of (A) 100 pts.wt. of a polyisobutylene compound expressed by formula (a) (R1 and R2 are each an alkyl or an alkenyl; and (m) is 8-800) and having a molecular weight of 500-50,000, (B) 20-60 pts.wt. of a hydrogenated polybutadiene compound having (meth)acrylate group and (C) a photo-radical polymerization initiator.
Inventors:
HIRABAYASHI KAZUHIRO
KISHI KATSUHIKO
KISHI KATSUHIKO
Application Number:
JP2004219612A
Publication Date:
February 09, 2006
Filing Date:
July 28, 2004
Export Citation:
Assignee:
THREE BOND CO LTD
International Classes:
C08F299/00; C09D5/00; C09D5/34; C09D7/12; C09D123/22; C09D147/00; C09K3/10
Domestic Patent References:
JP2000328042A | 2000-11-28 | |||
JP2005060465A | 2005-03-10 | |||
JPH0665334A | 1994-03-08 | |||
JP2003105320A | 2003-04-09 | |||
JPH0733837A | 1995-02-03 |
Foreign References:
WO2003086736A1 | 2003-10-23 |
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