Title:
RADIATION-CURABLE REACTION RESIN SYSTEM
Document Type and Number:
Japanese Patent JPH04233965
Kind Code:
A
Abstract:
PURPOSE: To obtain a radiation-curable reaction resin system which comprises a thermoplastic resin and a reaction resin compatible therewith and has a good storage stability.
CONSTITUTION: This resin system is a soln. prepd. by dissolving a thermoplastic resin (e.g. a polyether sulfone) in a reaction resin (e.g. a glycidyl ether type epoxy resin) compatible therewith, the concn. of the thermoplastic resin in the soln. being 3-50 wt.%. When exposed to a radiation, the system is cured to give a shaped material comprising a continuous phase and a dispersed phase having a particle size of 0.05-50 μm.
Inventors:
HAINAA BAIERU
BARUBAARA REENAA
MIHIAERU ROGARI
BARUBAARA REENAA
MIHIAERU ROGARI
Application Number:
JP21265291A
Publication Date:
August 21, 1992
Filing Date:
July 29, 1991
Export Citation:
Assignee:
SIEMENS AG
International Classes:
C08F2/50; C08F2/54; C08F226/10; C08F283/00; C08F291/00; C08F2/46; C08G59/00; C08G59/18; C08L63/00; C08L101/00; (IPC1-7): C08F2/46; C08F283/00; C08G59/18; C08L63/00; C08L101/00
Attorney, Agent or Firm:
Tomimura Kiyoshi
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