Title:
RADIATION-CURABLE RESIN COMPOSITION FOR FLATTENED LAYER, PLANARIZING LAYER, METHOD FOR PRODUCING PLANARIZED LAYER AND SOLID-STATE IMAGE SENSING DEVICE
Document Type and Number:
Japanese Patent JP2006199902
Kind Code:
A
Abstract:
To provide a radiation-curable resin composition imparting a cured product with low refractive index for a planarized layer of a solid-state image sensing device, excellent in coating property in spin coating, and to provide a flare-inhibited solid-state image sensing device having a planarized layer formed position-selectively by using the same.
The invention relates to the radiation-curable resin composition for a planarized layer comprising a fluorine-containing polymer containing an ethylenic unsaturated group and a solvent, and relates to the planarized layer obtained by curing the same, and a method for producing the flattened layer position-selectively and the solid-state image sensing device comprising the planarized layer.
Inventors:
YASHIRO TAKAO
YAMAMURA TETSUYA
TAKASE HIDEAKI
YAMAMURA TETSUYA
TAKASE HIDEAKI
Application Number:
JP2005022601A
Publication Date:
August 03, 2006
Filing Date:
January 31, 2005
Export Citation:
Assignee:
JSR CORP
International Classes:
C08F290/12; H01L27/14
Domestic Patent References:
| JP2001247622A | 2001-09-11 | |||
| JPH1184659A | 1999-03-26 | |||
| JP2006096983A | 2006-04-13 | |||
| JP2003183322A | 2003-07-03 |
Attorney, Agent or Firm:
Kihei Watanabe
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