To provide a radiation-curable resin composition being one-pack type, free from limitation of pot life and excellent in curing properties, coated film hardness, adhesion, heat resistance and storage stability, and a multilayer structure using the resin composition.

The radiation-curable resin composition comprises (A) an acrylic resin having 0-130°C glass transition temperature (Tg), (B) an unsaturated group-containing compound having an acid group or an ester structure and (C) a polymerizable compound having at least two (meth)acryloyl groups in the molecule [excluding the component (B)] and contains the component (C) in an amount of 5-100 pts.wt. based on 100 pts.wt. total of components (A) and (B). The structure is obtained by using the resin composition.