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Title:
RADIATION-CURABLE RESIN COMPOSITION AND MULTILAYER STRUCTURE USING THE SAME
Document Type and Number:
Japanese Patent JP2006169412
Kind Code:
A
Abstract:

To provide a radiation-curable resin composition being one-pack type, free from limitation of pot life and excellent in curing properties, coated film hardness, adhesion, heat resistance and storage stability, and a multilayer structure using the resin composition.

The radiation-curable resin composition comprises (A) an acrylic resin having 0-130°C glass transition temperature (Tg), (B) an unsaturated group-containing compound having an acid group or an ester structure and (C) a polymerizable compound having at least two (meth)acryloyl groups in the molecule [excluding the component (B)] and contains the component (C) in an amount of 5-100 pts.wt. based on 100 pts.wt. total of components (A) and (B). The structure is obtained by using the resin composition.


Inventors:
Matsunami, Hitoshi
Akiyama, Mamoru
Application Number:
JP2004000365201
Publication Date:
June 29, 2006
Filing Date:
December 17, 2004
Export Citation:
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Assignee:
NIPPON SYNTHETIC CHEM IND CO LTD:THE
International Classes:
C08F20/34; B32B15/082; C08F290/06; C09D4/02; C09D5/00; C09D7/12; C09D133/00; C09D143/02; C09D175/16; C09D191/00
Domestic Patent References:
JPH08283529A
JPH0586148A
JP2003026710A
JP2002214779A
JP2000231189A
JP2002287346A
JPH11323057A
JPS61291646A
JPS649212A