Title:
RADIATION-CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2005126622
Kind Code:
A
Abstract:
To provide a radiation-curable resin composition having good storage stability and high adhesiveness.
The radiation-curable resin composition contains the following components (A), (B), (C), and (D), wherein (A) is a polymerizable compound having an ethylenic unsaturated bond, (B) is a photopolymerization initiator, (C) is a silane coupling agent, and (D) is a phosphite other than the component (B), which has no functional group that can react with the component (A).
Inventors:
YAMAMOTO KEIICHI
KOMIYA ZEN
KOMIYA ZEN
Application Number:
JP2003365506A
Publication Date:
May 19, 2005
Filing Date:
October 27, 2003
Export Citation:
Assignee:
JSR CORP
JAPAN FINE COATINGS CO LTD
JAPAN FINE COATINGS CO LTD
International Classes:
C08F2/44; C08F2/46; C08F20/00; C08F26/06; C08F290/06; (IPC1-7): C08F2/44; C08F2/46; C08F20/00; C08F26/06; C08F290/06
Attorney, Agent or Firm:
Alga Patent Office, a patent business corporation
Miyuki Ariga
Toshio Takano
Toshio Nakajima
Asano Yasutaka
Hiromi Matoba
Masaki Murata
Hiroto Yamamoto
Miyuki Ariga
Toshio Takano
Toshio Nakajima
Asano Yasutaka
Hiromi Matoba
Masaki Murata
Hiroto Yamamoto
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