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Title:
RADIATION-CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS58145712
Kind Code:
A
Abstract:

PURPOSE: A composition which cures rapidly upon irradiation and shows excellent adhesion to metals, comprising a halogenated polyolefin or a halogenated diene polymer and a monomer having a radiation-polymerizable unsaturated double bond.

CONSTITUTION: A resin composition containing 1W40wt% halogenated polyolefin and/or halogenated diene polymer and 60W99wt% radiation-polymerizable double bond-containing monomer and/or its propolymer as essential components and a photopolymerization initiator as an optional component. The halogenated resins used are a halogenated polyolefin and/or a halogenated diene polymer, and are selected from halogenated resins soluble in the radiation-polymerizable unsaturated double bond-containing monomer and/or its polymer each of which plays a roll of both a crosslinking component and a solvent.


Inventors:
KONNO RIYOUZOU
MIHOYA TAKASHI
Application Number:
JP2819782A
Publication Date:
August 30, 1983
Filing Date:
February 25, 1982
Export Citation:
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Assignee:
TOYO INK MFG CO
International Classes:
C08F2/00; C08F2/48; C08F2/54; C08F289/00; C08F290/00; C08F299/00; C08F299/02; C09D5/00; C09D11/00; C09D11/033; C09D11/10; C09D11/101; C09D11/102; C09D11/106; C09D11/108; (IPC1-7): C08F2/54; C08F289/00; C08F299/02; C09D5/00; C09D11/02
Domestic Patent References:
JPS5682801A1981-07-06
JPS58138743A1983-08-17