Title:
RADIATION-CURING COMPOSITION, ITS CURING METHOD AND PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JP3499032
Kind Code:
B2
Abstract:
PURPOSE: To produce a radiation-curing compsn. causing a very slight decrease of its weight by curing, capable of curing with low intensity radiation and giving a heat resistant cured body and to provide a pattern forming method utilizing the compsn.
CONSTITUTION: This radiation-curing compsn. contains a base generating material which generates a base by the action of radiation and polymer molecules each having an Si-H bond which reacts with an OH group by the action of the base and can form an Si-O bond and 2. When this compsn. is cured by irradiation, a mask is put between a coating film of this compsn. and a radiation source and the uncured part is dissolved and removed to form a pattern.
Inventors:
Brian Robert Harkness
Mamoru Tachikawa
Mamoru Tachikawa
Application Number:
JP1619395A
Publication Date:
February 23, 2004
Filing Date:
February 02, 1995
Export Citation:
Assignee:
Dow Corning Asia Ltd.
International Classes:
C08K5/07; C08K5/16; C08K5/20; C08K5/205; C08K5/22; C08K5/28; C08K5/32; C08K5/33; C08K5/3412; C08K5/3415; C08K5/41; C08K5/42; C08L83/04; C08L83/05; C08L101/10; C09D5/00; C09D183/04; G03F7/004; G03F7/075; H01L21/027; (IPC1-7): G03F7/075; C08L83/05; C08L101/10; G03F7/004; H01L21/027
Domestic Patent References:
| JP6346025A | ||||
| JP6273936A | ||||
| JP6148895A | ||||
| JP6148887A | ||||
| JP6130668A |
Attorney, Agent or Firm:
Takashi Ishida (3 others)