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Patent Searching and Data


Title:
RADIATION DEVICE AND ASSEMBLING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2012184913
Kind Code:
A
Abstract:

To provide a radiation device and an assembling method of the same, that can improve a heat transfer effect between heat pipes adjacent to each other.

This method includes a step (A) for providing a heat transfer base and the plurality of heat pipes. The heat transfer base has a plurality of grooves in which the heat pipes are press-fitted. Further, this method includes a step (B) for press-fitting the heat pipes into the grooves, and a step (C) for deforming adjacent parts of the heat pipes adjacent to each other, so that the heat pipes are kept into contact with each other. Thus, the heat transfer effect among the heat pipes can be improved.


Inventors:
HUANG TSUNG-HSIEN
Application Number:
JP2011192691A
Publication Date:
September 27, 2012
Filing Date:
September 05, 2011
Export Citation:
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Assignee:
HUANG CHONGXIAN
International Classes:
F28D15/02
Domestic Patent References:
JP2009270750A2009-11-19
JP2010036251A2010-02-18
JP2009043963A2009-02-26
JP2000304476A2000-11-02
JP2011003604A2011-01-06
JP2010091257A2010-04-22
JP3142348U2008-06-12
Foreign References:
WO2010052889A12010-05-14
CN101951750A2011-01-19
US20100122799A12010-05-20
CN201750660U2011-02-16
Attorney, Agent or Firm:
服部 雅紀