Title:
RADIATION IMAGE PICKUP DEVICE AND SYSTEM
Document Type and Number:
Japanese Patent JP2002181944
Kind Code:
A
Abstract:
To strengthen the electric connection between a first substrate and a second substrate and to prevent a conductive adhesive from flowing to the side of an adjacent pixel.
In this radiation image pickup device, the first substrate with a transducing means for transducing radiation into electric signals and the second substrate with an accumulating means for accumulating the electric signals transduced by the transducing means are pasled together with the conductive adhesive. A spacer for holding a constant distance between the first substrate and the second substrate is provided between the first substrate and the second substrate.
More Like This:
Inventors:
ISHIZAKA HIROKI
OGAWA YOSHIHIRO
OGAWA YOSHIHIRO
Application Number:
JP2000377709A
Publication Date:
June 26, 2002
Filing Date:
December 12, 2000
Export Citation:
Assignee:
CANON KK
International Classes:
G01N23/04; G01T1/24; G01T7/00; H01L27/14; H01L27/146; H01L31/09; H04N5/32; H04N7/18; H05K1/14; (IPC1-7): G01T1/24; G01N23/04; G01T7/00; H01L27/14; H01L27/146; H01L31/09; H04N5/32; H04N7/18; H05K1/14
Attorney, Agent or Firm:
Yamashita