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Title:
RADIATION-SENSITIVE COMPOSITION AND COMPOUND
Document Type and Number:
Japanese Patent JP2011178670
Kind Code:
A
Abstract:

To provide a radiation-sensitive composition which is highly sensitive, has high resolution, and can form resist coating films formable of resist patterns excellent in nano-edge roughness.

The radiation-sensitive composition comprises a compound represented by general formula (1) (wherein, A is a single bond or the like; R1 is H or the like; R2 is 11 to 25C alkyl or the like; R3 is alkyl), a solvent, and a radiation-sensitive acid-generating agent.


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Inventors:
MARUYAMA KEN
SHIMIZU MAKOTO
Application Number:
JP2010041595A
Publication Date:
September 15, 2011
Filing Date:
February 26, 2010
Export Citation:
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Assignee:
JSR CORP
International Classes:
C07C309/65; C07C309/67; C07C309/73; G03F7/004; G03F7/039
Domestic Patent References:
JP2004002411A2004-01-08
JP2004075535A2004-03-11
JP2007114431A2007-05-10
JP2000035665A2000-02-02
JP2000034272A2000-02-02
JP2008096743A2008-04-24
JP2007206551A2007-08-16
Attorney, Agent or Firm:
Ippei Watanabe
Koji Kikawa
Hiroyuki Sato
Shigeru Koike



 
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