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Title:
RADIATION-SENSITIVE COMPOSITION AND HARD MASK FORMING MATERIAL
Document Type and Number:
Japanese Patent JP2006053404
Kind Code:
A
Abstract:

To provide a radiation-sensitive composition which forms a crosslinked structure upon exposure to radiation, is degraded to low molecular weight by heating at a relatively low temperature after crosslinking, can easily be removed without damaging a substrate, has a high stationary wave preventing effect, does not cause intermixing with a resist film, and is useful to form a hard mask capable of forming a resist pattern excellent in resolution, pattern profile, etc.

The radiation-sensitive composition comprises (A) a copolymer typified by a copolymer having a repeating unit represented by formula (1-1) and a repeating unit represented by formula (2-1), (B) a radiation-sensitive acid generator and (C) a solvent. In the formula (1-1), R5 denotes hydrogen atom or methyl group.


Inventors:
Sugita, Hikari
Tanaka, Masato
Konno, Keiji
Nomura, Nakaatsu
Shimokawa, Tsutomu
Application Number:
JP2004000235695
Publication Date:
February 23, 2006
Filing Date:
August 13, 2004
Export Citation:
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Assignee:
JSR CORP
International Classes:
G03F7/038; C08F220/26; C08F232/08; C08J3/24; H01L21/027; C08L33/04
Attorney, Agent or Firm:
福沢 俊明