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Patent Searching and Data


Title:
RADIATION SENSITIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2000066405
Kind Code:
A
Abstract:

To attain effective sensitivity to various radiations, to improve resolution, pattern shape, PED stability, etc., to reduce baking temp. dependency and to enhance process stability by incorporating a compd. having a specified substituent, a specified polymer having a specified ratio of wt. average mol. wt. (Mw) expressed in terms of polystyrene to number average mol. wt. (Mn) expressed in terms of polustyrence and a radiation sensitive acid generating agent.

The radiation sensitive compsn. contains a compd. having -C(= O)-OC(CH3)3 as a substituent having an acid cleavable t-butyl group, a polymer having acid decomposable acetal or ketal groups and an Mw to Mn ration 1-3 and 0.1-20 pts.wt., preferably 0.5-10 pts.wt. radiation sensitive acid generating agent based on 100 pts.wt. polymer.


Inventors:
SUZUKI MASAMUTSU
SAKURAI AKIHIKO
TANABE TAKAYOSHI
ISAMOTO YOSHITSUGU
Application Number:
JP22883399A
Publication Date:
March 03, 2000
Filing Date:
December 01, 1995
Export Citation:
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Assignee:
JSR CORP
International Classes:
H01L21/027; C08L25/00; C08L33/04; G03F7/004; G03F7/039; (IPC1-7): G03F7/039; C08L25/00; C08L33/04; G03F7/004; H01L21/027
Attorney, Agent or Firm:
Masataka Oshima