Title:
RADIATION-SENSITIVE RESIN COMPOSITION AND CURED FILM
Document Type and Number:
Japanese Patent JPH1160896
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To obtain a radiation-sensitive curable compsn. which forms an insulating layer which has excellent resolving properties, can be developed with an aq. alkali soln., and has high resistances to plating and heat and a low water absorption by compounding an alkali-soluble resin with a crosslinker, a compd. having at least one thiiranyl group in the molecule and a radiation polymn. initiator. SOLUTION: This compsn. comprises 30-95 wt.% alkali-soluble resin (A), 1-60 wt.% amino resin (B) having a plurality of active methylol groups in the molecule as the crosslinker, 1-50 wt.% compd. (C) having at least one thiiranyl group in the molecule and prepd. by substituting the oxygen atom of the oxirane ring of an oxirane-contg. compd. with a sulfur atom, and 0.01-5 wt.% radiation polymn. initiator (D), the sum of all the above ingredients being 100 wt.%. If necessary, a liq. rubber, a particulate rubber or the like is incorporated into the compsn. Polyvinylphenol having a wt. average mol.wt. of 200 or higher and/or another phenol resin is used as ingredient A.
Inventors:
SHIODA ATSUSHI
SUZUKI MASAKO
NIWA KAZUAKI
SATO HOZUMI
SUZUKI MASAKO
NIWA KAZUAKI
SATO HOZUMI
Application Number:
JP24343497A
Publication Date:
March 05, 1999
Filing Date:
August 25, 1997
Export Citation:
Assignee:
JSR CORP
International Classes:
G03F7/004; C08L61/06; G03F7/028; G03F7/038; G03F7/38; H05K3/46; (IPC1-7): C08L61/06; G03F7/004; G03F7/028; G03F7/038; G03F7/38; H05K3/46
Attorney, Agent or Firm:
Shuji Iwamiya
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