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Title:
RADIATION SENSITIVE RESIN COMPOSITION, ITS USE FOR INTERLAYER INSULATING FILM AND MICROLENS, INTERLAYER INSULATING FILM AND MICROLENS
Document Type and Number:
Japanese Patent JP2002287351
Kind Code:
A
Abstract:

To provide a radiation sensitive resin composition having high radiation sensitivity and a sufficient margin for development, capable of easily forming a patterned thin film excellent in adhesion and suitable for forming an interlayer insulating film and microlenses, to provide a use of the composition for an interlayer insulating film and microlenses and to provide an interlayer insulating film and microlenses formed from the composition.

The radiation sensitive resin composition contains [A] a copolymer of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride, (a2) an epoxy-containing unsaturated compound, (a3) a hydroxyl- containing unsaturated compound and (a4) another olefinically unsaturated compound and [B] a 1,2-quinonediazido compound. The interlayer insulating film and the microlenses are formed by using the composition.


Inventors:
NISHIMURA ISAO
TAKEUCHI NOBUHIRO
NISHIMURA HIDEKI
NIWA KAZUAKI
Application Number:
JP2001091877A
Publication Date:
October 03, 2002
Filing Date:
March 28, 2001
Export Citation:
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Assignee:
JSR CORP
International Classes:
C08J5/00; C08J5/18; C08K5/28; C08L33/00; C08L35/00; C08L101/12; G02B1/04; G03F7/022; G03F7/023; G03F7/032; (IPC1-7): G03F7/032; C08J5/00; C08J5/18; C08K5/28; C08L33/00; C08L35/00; G02B1/04; G03F7/022
Domestic Patent References:
JPH1152560A1999-02-26
JPH10207057A1998-08-07
JPH10153854A1998-06-09
JPH08262709A1996-10-11
JP2000347397A2000-12-15
JP2000327877A2000-11-28
JPH1152560A1999-02-26
JPH10207057A1998-08-07
JPH10153854A1998-06-09
JPH08262709A1996-10-11
JP2000347397A2000-12-15
JP2000327877A2000-11-28



 
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