To obtain a radiation sensitive resin composition excellent in physical properties such as transparency to radiation, dry etching resistance, sensitivity and resolution, shelf stability and adhesion by incorporating a specified alkali- insoluble or slightly alkali-soluble resin which is made alkali-soluble when an acid dissociable group is dissociated and a radiation sensitive acid generating agent.
The radiation sensitive resin composition contains an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin which is made alkali-soluble when the acid dissociable group is dissociated and a radiation sensitive acid generating agent. The resin is selected from a copolymer having repeating units of formulae I, II and III-1 and a copolymer having repeating units of formulae I, II and III-2. In the formulae, A and B are each H or a ≤20C acid dissociable organic group which is dissociated in the presence of an acid to form an acidic functional group, at least one of A and B is an acid dissociable organic group, X and Y are each H or a 1-4C alkyl, R1 is H, methyl or the like and R2 and R3 are each a di- or trivalent hydrocarbon group having an alicyclic group.
MURATA KIYOSHI
IWANAGA SHINICHIRO
ISHII HIROYUKI
IWAZAWA HARUO
