RADIATION-SENSITIVE RESIN COMPOSITION

Title:

RADIATION-SENSITIVE RESIN COMPOSITION

Document Type and Number:

Japanese Patent JP2003195507

Kind Code:

A

Abstract:

To provide a radiation-sensitive resin composition having high transparency for radiation, excellent basic performances as a resist such as sensitivity, resolution, dry etching durability, pattern profile, and suitable as a chemical amplification type resist having high resolution property in a fine pattern region.

The radiation-sensitive resin composition contains (A) a resin which contains a norbornene-based repeating unit derived from 5-(2-methyl-2- adamantyl)oxycarbonylbicyclo[2.2.1]hept-2-ene, 5-(1-methyl-1-cyclopentyl) ocycarbonylbicyclo[2.2.1]hept-2-ene or the like and a (meth)acrylate-based repeating unit derived from 3-hydroxy-1-adamantyl(meth)acrylate, 1-methyl-1- cyclohexyl(meth)acrylate or the like and which is converted into alkali-soluble by the effect of an acid, and (B) a radiation-sensitive acid generator.

Inventors:

NISHIMURA YUKIO
ISHII HIROYUKI
SANO KIMIYASU
KOBAYASHI HIDEKAZU

Application Number:

JP2001399235A

Publication Date:

July 09, 2003

Filing Date:

December 28, 2001

Export Citation:

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Assignee:

JSR CORP

International Classes:

G03F7/039; C08F232/04; G03F7/004; H01L21/027; (IPC1-7): G03F7/039; C08F232/04; G03F7/004; H01L21/027

Attorney, Agent or Firm:

Toshiaki Fukuzawa

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