RADIATION-SENSITIVE RESIN COMPOSITION

Title:

RADIATION-SENSITIVE RESIN COMPOSITION

Document Type and Number:

Japanese Patent JP2003241383

Kind Code:

A

Abstract:

To provide a radiation-sensitive resin composition excellent in contrast, capable of forming a fine resist pattern with a high degree of accuracy and excellent also in transparency to a radiation, sensitivity and resolution.

The radiation-sensitive resin composition comprises (A) a resin comprising an acid-dissociable group-containing norbornene compound typified by 5-[(1-methylcyclohexyl)oxycarbonyl]norbornene or 5-(2-methyl-1- adamantyloxycarbonyl)norbornene and maleic anhydride, (B) a radiation-sensitive acid generator and (C) a compound typified by a di-t-butyl 1,3- adamantanedicarboxylate or 2,5-dimethyl-2,5-di(1-adamantylcarbonyloxy)hexane. Preferably the resin (A) further comprises a polar group-containing alicyclic ester of (meth)acrylic acid typified by 3-hydroxy-1-adamantyl (meth)acrylate.

Inventors:

NISHIMURA YUKIO
HOSHI MICHIAKI
SOYANO AKIMASA
KAJITA TORU
ALLEN ROBERT D
VARANASI PUSHKARA RAO

Application Number:

JP2002046520A

Publication Date:

August 27, 2003

Filing Date:

February 22, 2002

Export Citation:

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Assignee:

JSR CORP
IBM

International Classes:

G03F7/039; C08F220/26; C08F220/34; C08F220/38; C08F222/06; C08F232/08; G03F7/004; H01L21/027; (IPC1-7): G03F7/039; C08F220/26; C08F220/34; C08F220/38; C08F222/06; C08F232/08; G03F7/004; H01L21/027

Attorney, Agent or Firm:

Toshiaki Fukuzawa

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