RADIATION-SENSITIVE RESIN COMPOSITION

Title:

RADIATION-SENSITIVE RESIN COMPOSITION

Document Type and Number:

Japanese Patent JP2003248313

Kind Code:

A

Abstract:

To provide a new radiation-sensitive resin composition having high transparency to a radiation, excellent in basic physical properties as a resist, such as sensitivity, resolution, pattern shape and adhesion to a substrate, causing no development defect in microfabrication and capable of producing semiconductor devices in a high yield.

The radiation-sensitive resin composition comprises (A) an acid-dissociable group-containing resin having a repeating unit represented by formula (I) and a repeating unit represented by formula (II) and (B) a radiation-sensitive acid generator. In the formula (I), X is methylene or carbonyl; R1 and R2 are each H, a 1-4C alkyl, a monovalent O-containing polar group or a monovalent N-containing polar group; R3 is H, a 1-6C alkyl, a 1-6C alkoxyl or a 2-7C alkoxycarbonyl; and n is an integer of 0-2.

Inventors:

NISHIMURA YUKIO
ISHII HIROYUKI
KATAOKA ATSUKO
TOMAS I WOROU
ALLEN ROBERT D
VARANASI PUSHKARA RAO

Application Number:

JP2002046974A

Publication Date:

September 05, 2003

Filing Date:

February 22, 2002

Export Citation:

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Assignee:

JSR CORP
IBM

International Classes:

G03F7/039; C08F222/06; C08F232/08; H01L21/027; (IPC1-7): G03F7/039; C08F222/06; C08F232/08; H01L21/027

Attorney, Agent or Firm:

Toshiaki Fukuzawa

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