Title:
RADIATION SENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2006317775
Kind Code:
A
Abstract:
To provide a radiation sensitive resin composition which suppresses occurrence of development defects, so that the yield of semiconductor devices can be improved.
The radiation sensitive resin composition comprises (A) a radiation sensitive acid generator containing at least one onium salt compound selected from iodonium salt compounds and sulfonium salt compounds, wherein an amount of ammonium monosulfide ((NH4)2S) is ≤1,000 ppm based on the amount of the onium salt compound; (B) an alkali-insoluble or slightly alkali-soluble resin having an acid-dissociable group; (C) a solvent; and (D) an acid diffusion inhibitor.
Inventors:
ITO NOBUJI
YOSHIDA KOICHIRO
NAGAI TOMOKI
YOSHIDA KOICHIRO
NAGAI TOMOKI
Application Number:
JP2005141207A
Publication Date:
November 24, 2006
Filing Date:
May 13, 2005
Export Citation:
Assignee:
JSR CORP
International Classes:
G03F7/004; G03F7/039; H01L21/027
Domestic Patent References:
| JPH09124533A | 1997-05-13 | |||
| JP2004117959A | 2004-04-15 | |||
| JP2002161118A | 2002-06-04 |
Foreign References:
| WO2003007079A1 | 2003-01-23 |
Attorney, Agent or Firm:
Ippei Watanabe
Koji Kikawa
Takeshi Higuchi
Koji Kikawa
Takeshi Higuchi