Title:
RADIATION-SENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2016057416
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition from which a resist pattern having small LWR can be formed with high sensitivity.SOLUTION: The radiation-sensitive resin composition is to be used for a resist pattern forming method including a step of infrared irradiation, and comprises a polymer having an acid dissociable group, a radiation-sensitive acid generator, a compound having a carbonyl group and a nitrogen atom, and a solvent. The above compound preferably has an absorption peak in the range from 2,500 nm to 6,700 nm. More preferably, the compound has absorption peaks in both of the range from 2,800 nm to 3,200 nm and the range from 5,500 nm to 6,500 nm. The carbonyl group preferably constitutes an acid dissociable group.SELECTED DRAWING: None
Inventors:
MOCHIDA KENJI
SHIMA MOTOYUKI
SHIMA MOTOYUKI
Application Number:
JP2014182796A
Publication Date:
April 21, 2016
Filing Date:
September 08, 2014
Export Citation:
Assignee:
JSR CORP
International Classes:
G03F7/004; C09K3/00; G03F7/038; G03F7/039; H01L21/027
Attorney, Agent or Firm:
Hajime Amano
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kazuki Kagami
Yoshiaki Negi
Kenichi Fujinaka
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kazuki Kagami
Yoshiaki Negi
Kenichi Fujinaka