RADIATION SENSITIVE RESIN COMPOSITION

Japanese Patent JP3633194

B2

PROBLEM TO BE SOLVED: To obtain a radiation sensitive resin compsn. excellent especially in contact hole resolution as a chemical amplification type resist and excellent also in radiation transmitting property, dry etching resistance, pattern shape, sensitivity, resolution, etc.
SOLUTION: This radiation sensitive resin compsn. contains a resin (A) having an alicyclic skeleton in the principal chain and/or a side chain, a resin (B1) having ≥60%/μm transmissivity to radiation of 100-300nm wavelength or a compd. (B2) having a mol.wt. of ≤1,000 represented by the formula and a radiation sensitive acid producing agent (C). At least one of the component A and the component B1 or B2 has an acid-cleavable group. In the formula, each of R1 and R2 is H or an acid-cleavable group, Z is a group having a cyclic hydrocarbon structure in which the total number of ring forming carbon atoms is 7-25, 0≤a≤6, 0≤b≤6 and (a+b)≥1.

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Mitsufumi Suwa
Haruo Iwasawa
Tohru Kajita
Shinichiro Iwanaga

JP7471897A

March 30, 2005

March 12, 1997

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JSR CORPORATION

G03F7/039; C08L35/00; C08L45/00; C08L65/00; H01L21/027; (IPC1-7): G03F7/039; C08L45/00; C08L65/00; H01L21/027

JP9015846A
JP8015865A
JP8082925A
JP10010739A
JP10111569A
JP9244247A
JP9230595A

Toshiaki Fukuzawa

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