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Title:
RADIATION SENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3873261
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To enable development with an alkaline aq. soln., to ensure high sensitivity and high resolution and to easily form a patterned thin film excellent in insulating property, flatness, etc., by using a specified fluorine-contg. copolymer, an acid generating compd. and an org. solvent.
SOLUTION: The radiation sensitive resin compsn. consists of a fluorine-contg. copolymer of hexafluoropropylene, a compd. having an ethylenically unsatd. bond and an acid-decomposable group represented by the formula, an unsatd. carboxylic acid and/or its anhydride and an unsatd. compd. copolymerizable with these three components, an acid generating compd., a crosslinking compd. and an org. solvent which dissolves these components. In the formula, M is C, Si, etc., R1-R3 are individually H, 1-10C linear alkyl, etc., and two of R1-R3 may bond to each other to form a 4- to 7-membered ring in combination with M to which they are bonded.


Inventors:
Isao Nishimura
Suzuki Masayoshi
Nobuhiro Takeuchi
Masayuki Endo
Application Number:
JP23946397A
Publication Date:
January 24, 2007
Filing Date:
September 04, 1997
Export Citation:
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Assignee:
JSR CORPORATION
International Classes:
G03F7/004; G03F7/039; C08F259/08; H01L21/027; H01L21/312; (IPC1-7): G03F7/039; C08F259/08; G03F7/004; H01L21/027; H01L21/312
Domestic Patent References:
JP10319593A
JP10026829A
JP9230596A
JP9146276A
JP7248629A
Attorney, Agent or Firm:
Masataka Oshima