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Title:
無線ICデバイス
Document Type and Number:
Japanese Patent JP5092600
Kind Code:
B2
Abstract:

To configure a wireless IC device having improved transmission efficiency of a signal with an antenna of a reader/writer by reducing the entire size and improving an emission property.

In this wireless IC device 10, a power supply circuit board 4 and a wireless IC chip 5 mounted thereon constitute an electromagnetic coupling module 1, a linear conductor 2 parallel with a central axis of a spiral is disposed inside a spiral conductor 7, one ends of the respective spiral conductor 7 and linear conductor 2 are connected to power-supply conductors 8a, 8b, and the other ends of the spiral conductor 7 and the linear conductor 2 are respectively opened. The wireless IC device 10 is configured by molding the spiral conductor 7, the linear conductor 2, and the power-supply conductors 8a, 8b by a mold resin 9, and attaching the electromagnetic coupling module 1 comprising the power supply circuit board 4 and the wireless IC chip 5 on the upper face thereof.

COPYRIGHT: (C)2009,JPO&INPIT


Inventors:
Yuya Doumi
Application Number:
JP2007185199A
Publication Date:
December 05, 2012
Filing Date:
July 17, 2007
Export Citation:
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Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
G06K19/077; G06K19/07; H01Q1/40; H01Q9/30; H01Q11/08; H01Q23/00; H04B5/02
Domestic Patent References:
JP2000172812A
JP2001168628A
JP2003216919A
JP2006005406A
JP2006325208A
JP2003032023A
JP2001143029A
JP2006114954A
JP2005352434A
Attorney, Agent or Firm:
Kaede International Patent Office
Hisao Komori



 
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