Title:
無線周波数通信アンテナモジュールおよびその製造方法
Document Type and Number:
Japanese Patent JP7053764
Kind Code:
B2
Abstract:
A radio frequency antenna module comprises a substrate having an accommodating structure for accommodating a chip module, and an antenna structure comprising a first coupling segment, a first extending antenna segment, and a first terminal antenna segment. The first coupling segment comprises a first coupling antenna segment and a second coupling antenna segment respectively having a pressed contact element electrically coupled to a first coupling part of the chip module. The first extending antenna segment is coupled to the substrate at a first side of the chip module. The first terminal antenna segment is coupled to the substrate at a second side of the chip module, wherein one end of the first terminal antenna segment is connected to one end of the second coupling antenna segment at the second side of the chip module. Alternatively, the present invention also provides a method for making the antenna module.
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Inventors:
English Shou
Application Number:
JP2020186058A
Publication Date:
April 12, 2022
Filing Date:
November 06, 2020
Export Citation:
Assignee:
Qi Technology Co., Ltd.
International Classes:
H01Q7/00; H01P11/00; H01Q1/24
Domestic Patent References:
JP2009015814A | ||||
JP2012114372A | ||||
JP2012093952A | ||||
JP2004171087A | ||||
JP2013122786A | ||||
JP2011018319A | ||||
JP2008219897A |
Foreign References:
US20150161503 |
Attorney, Agent or Firm:
Aiwa Patent Business Corporation