To provide a radio frequency module board and a manufacturing method for the radio frequency module board which is capable of improving an antenna characteristic with a simple configuration and is easy to manufacture.
An antenna board unit 100 includes a dielectric layer 10 and a first insulating layer 20. The dielectric layer 10 is made of a porous material. An antenna pattern 11 having a square shape is formed in a predetermined region on the upper surface of the dielectric layer 10. The first insulating layer 20 is installed on the lower surface of the dielectric layer 10 so as to sandwich a ground pattern 21. The ground pattern 21 has a slot 21s as an aperture. The slot 21s is arranged so as to be opposite to the center part of the antenna pattern 11 while sandwiching the dielectric layer 10 between the slot 21s and the antenna pattern 11. A microstrip line 22a capable of supplying high-frequency power is formed on the lower surface of the first insulating layer 20. Relative permittivity of the dielectric layer 10 at frequency of 1 GHz is set to be equal to or smaller than 2.00.
| JP2023032627 | ANTENNA DEVICE |
| JP4066192 | Chip antenna, antenna device using it, and wireless communication device |
| JPH11122022 | DIELECTRIC ANTENNA |
MATSUTOMI AKIHITO
KASAGI TOMOYUKI
IKENAGA HIROKO
| JP2012077294A | 2012-04-19 | |||
| JP2005079762A | 2005-03-24 | |||
| JP2003026850A | 2003-01-29 | |||
| JP2012019421A | 2012-01-26 | |||
| JP2010109435A | 2010-05-13 |
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