To output a stable image without being affected by temperature and electromagnetic waves.

Upper and lower shield members 32 are arranged on the upper and lower surfaces of flexible circuit boards 14 and 15 on the perimeter of a sensor substrate 12 through upper and lower heat insulating members 31. The undersurface of the upper shield member 32 is kept in contact with an inner frame 25 and the top surface of the upper shield member 32 with a large capacity outer frame 33. A conducting fiber 34 is applied to the external surfaces of the upper and lower shield members 32. An inner frame 26, the heat insulating members 31 and the shield members 32 shield the sensor substrate 12 spatially from an integrated circuit 20 for detection or the like and a signal processing circuit board 18 to check heat of the integrated circuit 20 for detection or the like and the signal processing circuit board 18 from transmitting to the sensor substrate 12. The conducting fiber 34 covers the shield members 32 to check an electric field attributed to a processing frequency of the signal processing circuit board 18 or the like from affecting the sensor substrate 12.