Title:
RADIOSENSITIVE COMPOSITION
Document Type and Number:
Japanese Patent JP3200824
Kind Code:
B2
Abstract:
PURPOSE: To obtain a radiosensitive composition suitable for a resist capable of stable fine working, having high sensitivity and high resolution and excellent in dry etching resistance, developing property, adhesive strength, heat resistance or the like by containing a polymer expressed by a specific formula and a radiosensitive acid forming agent.
CONSTITUTION: The polymer having a repeating unit expressed by the formula and the radiosensitive acid forming agent are contained. In the formula, R1 is substituted methyl group, substituted ethyl group or silyl group or the like, R2 is -OR3 or -NR4R5. Where R3 is hydrogen atom, linear alkyl group, cyclic alkyl group or the like, each of R4 and R5 is the same or different with each other and is hydrogen atom, linear alkyl group, cyclic alkyl group or the like. The radiosensitive composition is possible to corresponds to any of far infrared ray such as excimer laser, X ray such as synchrotronradioactive ray or charge radioactive ray such as electron beam and is advantageously used for a resist for producing integrated circuits, which is considered to be made finer furthermore.
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Inventors:
Makoto Murata
Mikio Yamachika
Kiji Yumoto
Takao Miura
Mikio Yamachika
Kiji Yumoto
Takao Miura
Application Number:
JP21605292A
Publication Date:
August 20, 2001
Filing Date:
August 13, 1992
Export Citation:
Assignee:
JSR Corporation
International Classes:
G03F7/004; G03F7/028; G03F7/033; G03F7/038; G03F7/039; H01L21/027; (IPC1-7): G03F7/039; G03F7/033; H01L21/027
Domestic Patent References:
| JP270A | ||||
| JP2146045A | ||||
| JP2103049A | ||||
| JP57501497A |
Attorney, Agent or Firm:
Masataka Oshima