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Patent Searching and Data


Title:
RAIL BOND TERMINAL, METHOD OF MOUNTING IT, AND FIXTURE FOR MOUNTING IT
Document Type and Number:
Japanese Patent JP2004273403
Kind Code:
A
Abstract:

To simply, reliably and uniformly fix a rail bond terminal to the upper part of a rail bottom part without causing peeling and falling.

In this method of mounting the rail bond terminal, at least a U-shaped heater forming a space is set on the upper surface of a rail bottom part, a fused binding material is placed in the space of the U-shaped heater, a rail bond terminal is laid on the fused binding material, the U-shaped heater is ignited while pushing the fused binding material, the U-shaped heater, and the rail bond terminal with the rail bottom part held between the upper and lower parts of the bottom part to fuse the fused binding material, and thereby the rail bond terminal is fixed to the upper surface of the rail bottom part. The rail bond terminal used in the above method has a planar part for fixing the rail bond terminal on the upper surface of the rail bottom part, and a single hole or a plurality of holes are bored in this planar part.


Inventors:
TAKAMIZAWA TOMONORI
KITADA AKIHIKO
KIKUCHI NORIMITSU
Application Number:
JP2003108378A
Publication Date:
September 30, 2004
Filing Date:
March 10, 2003
Export Citation:
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Assignee:
NICHU GIKEN KOGYO KK
SHINGO KIZAI KK
International Classes:
B23K1/00; B23K3/00; H01R4/64; H01R43/00; (IPC1-7): H01R4/64; B23K1/00; B23K3/00; H01R43/00
Attorney, Agent or Firm:
Kazuo Matsuzaki