Title:
SEMICONDUCTOR DEVICE AND MOUNTING METHOD THEREOF
Document Type and Number:
Japanese Patent JP3235403
Kind Code:
B2
Abstract:
PURPOSE: To realize excellent mounting of a millimeter wave band chip in which disturbance of impedance is suppressed at the joint.
CONSTITUTION: Before a chip is MBB mounted on a board 100, pad parts 131, 132 are trimmed thinner than line parts 103, 104 such that the line on the board and chip side has substantially same thickness as the line at the joint after the chip is mounted on the board 100. Since the pad part can be made as thick as the line after the chip is mounted on the board, disturbance of impedance is suppressed at the joint and a good mounting is realized.
Inventors:
Hiroyuki Sakai
Junmichi Ota
Kaoru Inoue
Junmichi Ota
Kaoru Inoue
Application Number:
JP11550395A
Publication Date:
December 04, 2001
Filing Date:
May 15, 1995
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/60; H01L23/02; H01L23/04; H01L23/12; H01P1/04; H01P3/08; H01P5/08; H03H7/38; (IPC1-7): H01L23/12; H01L21/60; H01P3/08
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)