Title:
FORMATION OF SOLDER BUMP
Document Type and Number:
Japanese Patent JP3233301
Kind Code:
B2
Abstract:
PURPOSE: To form a bump such that high density mounting of electronic components can be realized with high reliability.
CONSTITUTION: A resist layer 6 having an opening 6a is formed at the part of a barrier metal layer 5 covering aluminium pads 2 provided on a substrate 1. The opening 6a is elongated rectangularly in the direction contiguous to no pad and a solder layer 7 is formed therein thus increasing the height of a solder bump after etch back.
Inventors:
Yuji Ozaki
Application Number:
JP35062692A
Publication Date:
November 26, 2001
Filing Date:
December 04, 1992
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L21/60; H01L21/321; (IPC1-7): H01L21/60
Domestic Patent References:
| JP63258045A | ||||
| JP287526A | ||||
| JP432235A |
Attorney, Agent or Firm:
Yoshio Inamoto