Title:
RAW MATERIAL POLYIMIDE RESIN FOR ADHESIVE, COVERLAY FILM AND BONDING SHEET
Document Type and Number:
Japanese Patent JP2017133001
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polyimide resin adhesive having no generation of a volatile component consisting of a cyclic siloxane compound and no reduction of adhesive force of a wiring layer and a coverlay film even when exposed to a high temperature repeatedly.SOLUTION: There is provided a polyimide resin adhesive containing a raw material polyimide resin for adhesive for forming an adhesive layer of a coverlay film or an adhesive layer for a bonding sheet, which has weight average molecular weight in a range of 20,000 to 150,000 and is manufactured by blending aromatic diamine such as aromatic tetracarboxylic acid anhydride, aliphatic diamine having 24 to 48 carbon atoms, 4,4'-bis(3-aminophenoxy)benzophenone and 9,9-bis(4-aminophenyl)fluorene.SELECTED DRAWING: None
Inventors:
NAKANISHI TETSUYA
MORI AKIRA
SUDO YOSHIKI
MORI AKIRA
SUDO YOSHIKI
Application Number:
JP2017008823A
Publication Date:
August 03, 2017
Filing Date:
January 20, 2017
Export Citation:
Assignee:
NIPPON STEEL & SUMIKIN CHEM CO
International Classes:
C08G73/10; B32B27/34; C09J7/02; C09J179/08; H01L21/52
Domestic Patent References:
| JP2013001730A | 2013-01-07 | |||
| JP2010006983A | 2010-01-14 | |||
| JP2011256372A | 2011-12-22 | |||
| JP2010163489A | 2010-07-29 |
Foreign References:
| WO2007116979A1 | 2007-10-18 | |||
| US3803103A | 1974-04-09 |
Attorney, Agent or Firm:
Kazuhiro Watanabe
Noboru Tajime
Tajime Keiko
Taji U.S. Patent Office
Noboru Tajime
Tajime Keiko
Taji U.S. Patent Office