Title:
Reactant hot melt adhesive
Document Type and Number:
Japanese Patent JP6117941
Kind Code:
B2
Abstract:
The present disclosure relates to silane reactive hot melt adhesive compositions including acid functional wax and basic functional wax; the production of such adhesives; and the use of such adhesives. The silane reactive hot melt adhesive compositions have improved green strength as compared to silane reactive hot melt adhesive compositions without the acid functional wax and basic functional wax.
Inventors:
Suen, Wu
Application Number:
JP2015555172A
Publication Date:
April 19, 2017
Filing Date:
January 02, 2014
Export Citation:
Assignee:
Henkel AG & Co. KGaA
International Classes:
C09J201/10; C09J11/06; C09J11/08
Domestic Patent References:
| JP2009503133A | ||||
| JP10500708A | ||||
| JP2015527441A |
Foreign References:
| WO2006016568A1 | ||||
| US6121354 | ||||
| WO2011087741A1 |
Attorney, Agent or Firm:
Katsuhiro Ito
Akiko Ono
Akiko Ono