REACTION INJECTION MOLD

Japanese Patent JP3432582

B2

PURPOSE: To cheapen the cost of a mold employed for RI system or SRI molding system and facilitate the after fabrication and maintenance of a product by a method wherein the edge part of a cavity marked off by a top and a bottom molds and a mating mold surface near the edge parts are made of hard metal and, at the same time, seal is provided in the neighborhood of a mating surface.
CONSTITUTION: Nickel plating is applied onto the mold surfaces of the top mold 1 and the bottom mold 2 of a reaction injection mold by RI system so as to mark off a cavity 3 within the mold by mold clamping. Duralumin seats 5 and 6 are laid into the edge parts of the cavities 3 of the top mold 1 and the bottom mold 2 and the mating surface parts in the neighborhood of the edge parts. Over the whole outer periphery of the seat 6, silicone packing 7 is buried. At the position corresponding to the packing 7 of the top mold 1, a projecting bead 8, which comes into close contact with the packing 7 at mold clamping, is provided. Over the whole outer periphery of the packing 7, an O-ring 9, which comes into close contact with the mating surface of the bottom mold 2 at mold clamping, is provided. By means of the packing 7, the projecting bead 8 and the O-ring 9, the resin efflux out of the cavity 3 is doubly prevented from occurring. Accordingly, the strength of the mold at the portion corresponding to a product can be ensured and the rework of the product can be prevented from developing.

Shigeru Kobayashi
Tomohiro Sakuraba

JP7419394A

August 04, 2003

March 18, 1994

Click for automatic bibliography generation  

Honda motor industry stock company

B29C33/38; B29C45/00; B29C45/14; B29C45/26; B29K101/10; B29K105/08; (IPC1-7): B29C45/26; B29C33/38; B29C45/00

JP5116172A
JP68253A
JP6258866A
JP3120021A
JP3115322A

Youichi Ohshima

Previous Patent: PHOTORESIST RELEASING AGENT COMPOSITION

Next Patent: REGISTER FOR AUTOMOBILE