Title:
REACTIVE GAS PLASMA TREATING DEVICE
Document Type and Number:
Japanese Patent JPH04354877
Kind Code:
A
Abstract:
PURPOSE: To reduce the idle time for maintenance in a reactive gas plasma treating device and to improve its productivity.
CONSTITUTION: A device 16 capable of singly evacuating the pipeline for a reactive gas used in plasma treatment is provided independently of a main evacuating device 6 for a treating chamber 1. Consequently, the damage of the main evacuating device 6 by the reactive gas is moderated, and the idle time for maintenance is reduced. Meanwhile, the amt. of the reactive gas to be passed through a treating chamber 7 is decreased, hence the damage of the treating chamber 7 is moderated, and the time taken to evacuate the reactive gas pipeline is reduced.
Inventors:
TANAHASHI HIDEKI
Application Number:
JP15374591A
Publication Date:
December 09, 1992
Filing Date:
May 30, 1991
Export Citation:
Assignee:
HITACHI LTD
International Classes:
C23C16/50; C30B25/14; H01L21/302; H01L21/3065; H01L21/31; H05H1/18; (IPC1-7): C23C16/50; C30B25/14; H01L21/302; H01L21/31; H05H1/18
Attorney, Agent or Firm:
Kenjiro Take