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Title:
REACTIVE HOT-MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP3296867
Kind Code:
B2
Abstract:

PURPOSE: To improve the hot-melt applicability, stickiness, initial adhesive properties, and heat resistance of the subject compsn. by compounding a specific silylated graft copolymer with a low-molecular polymer.
CONSTITUTION: 10-90 pts.wt. graft copolymer having a number-average mol.wt. (Mn) of 10,000-200,000 and selected from a graft copolymer which is obtd. by polymerizing a vinyl-terminated macromer having an Mn of 2,000 or higher and a glass transition point (Tg) of 20°C or higher with an alkyl (meth)acrylate and has silyl groups of the formula (wherein X is a hydrolyzable group; Y is methyl or ethyl; and (n) is 0-2) and a Tg of the segment derived from the (meth)acrylate of -75 to -20°C and a graft copolymer which is obtd. by polymerizing the (meth)acrylate in the presence of a thermoplastic resin and has silyl groups of the formula in the molecule and a Tg of the segment derived from the (meth)acrylate of -75 to 20°C is compounded with 90-10 pts.wt. low- molecular polymer which is obtd. from a monomer component mainly comprising vinyl acetate and/or the (meth)acrylate and has silyl groups of the formula in the molecule, an Mn of 500-800, and a Tg of -40 to 100°C.


Inventors:
Eiichi Kawasaki
Kiyoto Doi
Kazuya Shinoda
Tadashi Kitamura
Kosuke Suekaka
Application Number:
JP35802192A
Publication Date:
July 02, 2002
Filing Date:
December 25, 1992
Export Citation:
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Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08F299/00; C08F290/00; C09J131/04; C09J151/00; C09J155/00; C09J157/00; C09J175/00; C09J175/04; C09J201/00; C09J201/10; (IPC1-7): C09J151/00; C09J131/04; C09J157/00; C09J175/04; C09J201/10
Domestic Patent References:
JP270786A
JP60260668A
JP3504986A
Attorney, Agent or Firm:
Toshizo Iida