To obtain a reactive hot-melt composition, capable of readily performing hot-melt coating, rapidly cross-linkable by heating after bonding an adherend without requiring radiation and water and without producing water at the time of cross-linking and having a high fluidity at the time of hot melting.

This precursor composition comprises a thermoplastic polymer containing a polyolefin having epoxy groups in the molecule and a radiation- polymerizable component containing an aliphatic alkyl (meth)acrylate and an acrylic compound having a functional group reactive with epoxy group in the molecule. Furthermore, the hot-melt composition is obtained by exposing the precursor composition to radiation and polymerizing the radiation-polymerizable component.