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Patent Searching and Data


Title:
REACTIVE INJECTION MOLDING METHOD
Document Type and Number:
Japanese Patent JPS5954539
Kind Code:
A
Abstract:

PURPOSE: To obtain moldings having beautiful surface by preventing the occurrence of voids or pinholes by a method in which while a reactive mixture injected is sealed by a specified fluid, the mixture is packed into the cavity of molds.

CONSTITUTION: A reactive mixture, e.g., polyurethane resin, etc., injected from the head 3 of a mixer is sealed by a fluid inert to the components of the reactive mixture and having a boiling point of about -30°C or more, which is packed in a runner. The reactive mixture is then cast into the cavity 6 of molds to obtain a molding having a beautiful surface with lesser defects, e.g., voids, blisters, etc. The fluid used is preferably gaseous ones having a boiling point below the molding temperatures but above about 0°C, e.g., one or more of organic compounds such as halogenated hydrocarbons, etc.


Inventors:
NISHIHARA AKIRA
Application Number:
JP16314482A
Publication Date:
March 29, 1984
Filing Date:
September 21, 1982
Export Citation:
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Assignee:
ASAHI GLASS CO LTD
International Classes:
B29C45/00; B29C39/24; B29C43/00; B29C45/46; B29C67/24; B29K75/00; (IPC1-7): B29D27/00; B29G3/00
Attorney, Agent or Firm:
Akira Uchida