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Title:
車両用リアバンパ構造
Document Type and Number:
Japanese Patent JP7102894
Kind Code:
B2
Abstract:
To provide a vehicle rear bumper structure which enables improvement of rigidity of a rear bumper and efficient installation of electric components.SOLUTION: A bumper structure 100 includes a rear bumper 104 on which predetermined electric components are mounted. The rear bumper 104 has: a license plate attachment area 106 provided at a center as seen in a vehicle width direction; and a pair of expansion areas 108a, 108b which expand to the vehicle rear side further than the license plate attachment area 106 at both sides of the license plate attachment area 106 as seen in the vehicle width direction. The bumper structure 100 further includes a reinforcement member 118 attached to an upper part of the license plate attachment area 106 at the vehicle front side of the rear bumper 104 and extending in the vehicle width direction to the pair of expansion areas 108a, 108b. The electric components may be fixed to the reinforcement member 118.SELECTED DRAWING: Figure 2

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Inventors:
Takuya Sakamoto
Application Number:
JP2018080397A
Publication Date:
July 20, 2022
Filing Date:
April 19, 2018
Export Citation:
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Assignee:
SUZUKI KABUSHIKI KAISHA
International Classes:
B60R19/50
Domestic Patent References:
JP2008540219A
JP2010030518A
JP2204150A
JP57122450U
JP3033754U
Foreign References:
KR101724916B1
Attorney, Agent or Firm:
Daisuke Suzuki
Kosuke Tobita
Patent Business Corporation Aqua Patent Office