Title:
受信回路
Document Type and Number:
Japanese Patent JP4616226
Kind Code:
B2
Inventors:
Takashi Oya
Application Number:
JP2006250576A
Publication Date:
January 19, 2011
Filing Date:
September 15, 2006
Export Citation:
Assignee:
oki Semiconductor Co., Ltd.
International Classes:
H04B1/26; G04G5/00; G04R20/00; G04R20/10; H03H19/00
Domestic Patent References:
| JP2006121665A | ||||
| JP2004531132A | ||||
| JP10163912A | ||||
| JP2005094534A | ||||
| JP10112669A | ||||
| JP2005252641A |
Attorney, Agent or Firm:
Motohiko Fujimura
Shigeyuki Nagaoka
Shinji Takano
Shigeyuki Nagaoka
Shinji Takano