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Patent Searching and Data


Title:
RECLAIMED SOLDER, MANUFACTURING METHOD THEREFOR, AND SOLDERING METHOD
Document Type and Number:
Japanese Patent JP2001148567
Kind Code:
A
Abstract:

To provide reclaimed solder, having composition which very closely approximates to melt, a method for effectively manufacturing it at a low cost, and a soldering method using the reclaimed solder.

In this manufacturing method, reclaimed solder is obtained by discharging dross 2 from a fused solder tank 1, reducing the dross 2, and supplying the composition which has transferred from the melt 8 in the tank 1 to the dross 2 to the reduced dross. By supplying the reclaimed solder to the tank 1, the composition of melt can be maintained almost as is. It is also applicable that dross containing cerium may be discharged from the tank 1, and the cerium component which has transferred from the melt 8 to the dross 2 be supplied directly to the melt in the tank 1.


Inventors:
NAGASAWA HIROYUKI
HANIYU KAZUTAKA
Application Number:
JP33094799A
Publication Date:
May 29, 2001
Filing Date:
November 22, 1999
Export Citation:
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Assignee:
SONY CORP
International Classes:
B23K3/06; B23K1/08; B23K35/26; C22B7/00; C22B9/02; H05K3/34; (IPC1-7): H05K3/34; B23K1/08; B23K3/06; B23K35/26
Attorney, Agent or Firm:
Hiroshi Osaka