Title:
再構成可能な半導体装置
Document Type and Number:
Japanese Patent JP6564186
Kind Code:
B2
Inventors:
Masayuki Sato
Yuki Sato
Yuki Sato
Application Number:
JP2014543395A
Publication Date:
August 21, 2019
Filing Date:
October 27, 2013
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H03K19/177
Domestic Patent References:
| JP2003149300A | ||||
| JP2003224468A | ||||
| JP2004248282A | ||||
| JP2009194676A |
Foreign References:
| WO2007060738A1 | ||||
| US20070222477 | ||||
| US6998872 | ||||
| US5815726 |